POLYIMIDE RESIN CAS:62929-02-6

  • Product Name:POLYIMIDE RESIN
  • CAS:62929-02-6
  • Molecular formula:C35H28N2O7
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POLYIMIDE RESIN CAS:62929-02-6

POLYIMIDE RESIN CAS:62929-02-6 Basic information

Product Name: POLYIMIDE RESIN
Synonyms: POLYIMIDE RESIN POWDER;-2,3-dihydro-1,3,3(or1,1,3)-trimethyl-1h-inden-5-amine;3-isobenzofurandione,5,5 -carbonylbis-polymerwith1(or3)-(4-aminophenyl);POLYIMIDE RESIN;Polyimideresins;Polyimides;1,3-Isobenzofurandione, 5,5-carbonylbis-, polymer with 1(or 3)
CAS: 62929-02-6
MF: C35H28N2O7
MW: 588.60602
Mol File: 62929-02-6.mol

POLYIMIDE RESIN CAS:62929-02-6 Chemical Properties

density: 1.2
Melting point: >300°C
form: Powder
Water Solubility: Insoluble in water.
Fp: >93°(199°F)
Specific Gravity: 1.2
EPA Substance Registry System: 1,3-Isobenzofurandione, 5,5 -carbonylbis-, polymer with 1(or 3)-(4-aminophenyl)-2,3-dihydro-1,3,3(or 1,1,3)-trimethyl-1H-inden-5-amine (62929-02-6)

产品名称Product Name

聚酰亚胺树脂POLYIMIDE RESIN

色状Color&Appearance

黄色粉末Yellow powder

相对密度Density

 

1.3g/CM3

含量(%) Assay

 

≥99%

马丁耐热温度

Martin heat-resistant temperature

 

260°C

抗拉强度

Tensile strength

 

113.4MPa

粒径Size

 

30-40um

软 化 点 Softening Point

 

110°C-130°C

固化温度

Curing temperature

 

220°C-230°C

吸水性

Water absorption

0.2-0.3%

抗弯强度

Flexural strength

 

>1000MPa

POLYIMIDE RESIN Usage And Synthesis
UsesPolyimides (PI, also known by alternative brand names: Pyralin Apical, Kapton, and Kaptrex) are polymers made of imide monomers (two carbonyl groups bonded to nitrogen). It has a density of 1430 kg/m3, Young’s modulus 3200 MPa, tensile strength (75–90) MPa, glass transition temperature > 400℃, thermal conductivity of 0.53 W/(m K), and a low relative dielectric constant of 2.9. Polyimides have applications similar to BCBs and also find applications as a low dielectric constant material in high-frequency interconnects (low-k material). The higher thermal conductivity and high glass transition temperature when compared to other types of insulating polymers also makes them a good choice where heat dissipation is important or other applications requiring good thermal management or low parasitic capacitances. Microchannels and high-frequency microdevices embedded in both photosensitive and nonphotosensitive polyimides have been fabricated and reported.
Industrial usesAvailable both as thermoplastic and thermosetresins, polyimides (PIs) are a family of someof the most heat- and fire-resistant polymersknown. Moldings and laminates are generallybased on thermoset resins, although some aremade from thermoplastic grades. Unlike mostplastics, polyimides are available as laminatesand shapes, molded parts, and stock shapesfrom some materials producers. Thin-film products— enamel, adhesives, and coatings — areusually derived from thermoplastic polyimideresins.
Polyimide parts and laminates can serve continuouslyin air at 260°C; service temperaturefor intermittent exposure can range from cryogenicto as high as 482°C. Glass-fiber-reinforcedversions retain over 70% of their flexuralstrength and modulus at 249°C. Creep is almostnonexistent, even at high temperatures, anddeformation under load (27.2 MPa) is less than0.05% at room temperature for 24 h.
These materials have good wear resistanceand low coefficients of friction, both of whichare further improved by polytetrafluoroethylenefillers. Self-lubricating parts containing graphitepowders have flexural strengths above 68MPa, which is considerably higher than thoseof typical thermoplastic bearing compounds.
Electrical properties of polymide moldingsare outstanding over a wide range of temperatureand humidity conditions.


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